23 Jul METHOD FOR TWO- AND THREE-DIMENSIONAL MICROASSEMBLY OF PATTERNS AND STRUCTURES
Posted at 13:56h
in rest
Abstract
The present invention relates to a method for creating two- and three-dimensional arrays. Plates of sample materials are stacked to create primary stacks. Primary stacks are sliced to form combs. Combs are stacked to form secondary stacks. Secondary stacks are sliced to form tertiary plates or two-dimensional arrays. Tertiary plates can be stacked to form three-dimensional arrays. The two- and three-dimensional arrays can be used in large-scale parallel processing of samples, pattern printing, tissue engineering, microfluidics, microelectronics, and microconstruction.
Year: 2005
Country: WO
Doc No: 2005040348